Ultrasonic spraying technology-catalyst coating preparation application field

Fuel cell field

Proton exchange membrane fuel cell (PEMFC): Platinum has excellent catalytic properties and plays a key role in PEMFC. Through ultrasonic spraying, platinum catalyst can be evenly coated on the surface of the electrode substrate to improve its catalytic performance and conductivity. At the same time, the ultrasonic spraying system can also be used to accurately, precisely and evenly spray the catalyst onto the electrolyte membrane layer, minimizing overspraying, which plays a major role in spraying equipment optimization, repeatability, sustainability and cost savings.

Direct methanol fuel cell (DMFC) and solid oxide fuel cell (SOFC): Ultrasonic spraying technology can be used to prepare catalyst coatings for these fuel cells, such as platinum nickel, iridium and ruthenium-based fuel cell catalyst coatings. This technology can produce highly uniform, repeatable and durable coatings, well control coating properties, significantly reduce material usage, and reduce maintenance and downtime.

Solar cell field

Perovskite solar cells: Ultrasonic spraying technology successfully prepared high-quality and uniform perovskite films by optimizing the preparation and spraying parameters of perovskite solution. The photoelectric conversion efficiency of the best tandem cell prepared by ultrasonic spraying technology has laid a solid foundation for the commercial application of ultrasonic spraying technology in perovskite solar cells.

Thin-film solar cells: Ultrasonic spraying technology shows good potential in the manufacture of thin-film cells and can be used as a low-cost and efficient deposition method. For example, aluminum-doped zinc oxide thin films can be uniformly deposited by ultrasonic spraying. AZO is a transparent conductive oxide (TCO) that is crucial in thin-film cells. By optimizing parameters such as atomization power and precursor flow rate, AZO thin films not only have good transmittance, but also achieve low resistivity and improve battery performance.

Electronic components field

Circuit board flux spraying: Ultrasonic nozzles show high precision and high efficiency in selective soldering and PCB flux spraying. Through low-flow, focused spray, the flux is accurately deposited in the target area, suitable for ball grid arrays and flip chips, etc. Compared with traditional methods, ultrasonic spraying saves 80% of flux materials, reducing defect rates and costs.

Wafer photoresist coating: Ultrasonic nozzles are widely used in semiconductor manufacturing for photoresist coating of silicon and gallium arsenide wafers. It uses high-frequency vibration to atomize the liquid into fine droplets, and sprays them on the wafer accurately and at low speed. Compared with pressure nozzles or spin coating, it reduces material consumption by up to 70%, reduces overflow and contamination, and improves coating uniformity and development efficiency.