Advances in communication technology have led to the development of a variety of optoelectronics and integrated optical components. Applications include dense wavelength division multiplexing (DWVDM), optical isolation, signal processors and optical switches. Logitech has a large selection of systems suitable for the preparation of optoelectronic materials, such as silicon, acid processing, acid processing, silicon oxide, barium acid and similar materials. Our systems, accessories and consumables provide fault-free surface and edge finishes on photoelectric substrates and scratch free surfaces with strict and repeatable dimensional tolerances.
Wafer bonding machine is mainly used in the assembly of optical fiber machines. Optical machines are usually assembled from several small optical components that need to be positioned precisely and kept at the correct angles and spacing. Wafer bonding machine can complete a large number of optical assembly in a short time, and the precision between assembly can reach a very high level, effectively improve the assembly efficiency and product quality.
